Inert atmosphere soldering apparatus

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces

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Details

228 40, 228 561, 118429, H05K 334, B23K 306

Patent

active

058605827

ABSTRACT:
An inert atmosphere spot soldering process and apparatus uses pockets arranged to match the arrangement of the terminals to be soldered. The pockets are filled to over flowing with liquid solder by lowering the pockets below the surface of the molten solder in a solder pot. A flow of hot inert gas is provided through orifices adjacent the pockets. The terminals and their surrounding area are exposed to the hot inert gas for a period sufficient to drive off substantially all volatile liquids and the terminals are then immersed in the solder to a depth determined by the menicus of the solder in the pockets. After immersion, the terminals are seperated from the solder surface and the flow of inert gas is terminated after permitting the solder to solidify. The inert gas may be heated by thermal conduction from the liquid solder.

REFERENCES:
patent: 5112559 (1992-05-01), Lebrun

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