Inert atmosphere soldering apparatus

Details Inert atmosphere soldering apparatus Inert atmosphere soldering apparatus

1995-12-22

1998-01-27

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228232, 228259, B23K 108, H05K 334

Patent

active

057114730

ABSTRACT:
An inert atmosphere spot soldering process and apparatus uses cups arranged to match the arrangement of the terminals to be soldered. The cups are filled to over flowing with liquid solder and provided with a enveloping flow of hot inert gas. The terminals and their surrounding area are exposed to the hot inert gas for a period sufficient to drive off substantially all volatile liquids and the terminals are then immersed in the solder. After immersion, the terminals are raised gently non parallel to the solder surface until they are above the solder and then the flow of inert gas is terminated permitting the solder to solidify. The inert gas may be heated by thermal conduction from the liquid solder.

REFERENCES:
patent: 2671264 (1954-03-01), Pessel
patent: 3386166 (1968-06-01), Tardoskegyi
patent: 3828419 (1974-08-01), Wanner
patent: 4311266 (1992-01-01), Kondo
patent: 4606493 (1986-08-01), Christoph et al.

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