Industrial microdeposition system including masking to...

Details Industrial microdeposition system including masking to... Industrial microdeposition system including masking to...

2002-11-27

2009-11-03

Tran, Binh X (Department: 1792)

Coating processes

Direct application of electrical, magnetic, wave, or...

Electrostatic charge, field, or force utilized

C427S468000, C427S479000, C427S504000, C118S669000, C118S679000, C118S680000

Reexamination Certificate

active

07611754

ABSTRACT:
A microdeposition system microdeposit droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define subfeatures of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.

REFERENCES:
patent: 6019454 (2000-02-01), Serra et al.
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patent: 6283572 (2001-09-01), Kumar et al.
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patent: 2004/0223014 (2004-11-01), Barr et al.
patent: 0863478 (1998-03-01), None
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EPO Search Report dated Mar. 31, 2009.

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