Inductor utilizing pad metal layer

Details Inductor utilizing pad metal layer Inductor utilizing pad metal layer

2011-06-28

2011-06-28

Tran, Tan N (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257S277000, C257SE21022

Reexamination Certificate

active

07968968

ABSTRACT:
An inductor utilizing a pad metal layer. The inductor comprises a metal spiral, a metal bridge, and a metal interconnect. The metal bridge is formed with the pad metal layer and a plurality of vias and has one end connected to the metal spiral. The metal interconnect is connected to the other end of the metal bridge. In addition, resistivity of the pad metal layer is lower than that of the metal spiral.

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patent: 6356183 (2002-03-01), Jou
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patent: 2001/0028098 (2001-10-01), Liou
patent: 2005/0275497 (2005-12-01), Ramadan et al.
patent: 2006/0022287 (2006-02-01), Itoi et al.
patent: 2006/0170072 (2006-08-01), Nakashiba

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