Inductive element and manufacturing method of the same

Details Inductive element and manufacturing method of the same Inductive element and manufacturing method of the same

2007-05-01

2007-05-01

Mai, Anh (Department: 2832)

Inductor devices

Coil or coil turn supports or spacers

Printed circuit-type coil

C336S083000, C336S223000

Reexamination Certificate

active

10773318

ABSTRACT:
Conductor layers2A and insulating layers4A are alternately stacked so as to prepare a base material17. A plurality of grooves18having a predetermined width are formed in a surface of the base material17in such a manner that these plural grooves18are located parallel to each other along a stacking layer direction in order to form a coil inner peripheral portion. Embedding materials5are filled into the grooves18. Surfaces16of the base material into which the embedding materials5have been filled are flattened by polishing. The conductor layers2A located adjacent to each other are connected to each other, so that helical coils which constitute inductive elements are constructed. Then, both the front plane and the rear plane of the resultant base material are covered by an insulating layer, which is cut so as to obtain respective chips.

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