Metal working – Method of mechanical manufacture – Electrical device making
Patent
1987-09-14
1989-04-04
Corbin, John K.
Metal working
Method of mechanical manufacture
Electrical device making
29846, 29852, 2191216, 21912165, 21912168, 338308, H01C 1706
Patent
active
048172693
ABSTRACT:
A process for forming electrically conductive circuitry on a metallic nonconductive substrate or insulating layer which includes the steps of providing a nonconductive ceramic substrate having a metallic component and which can dissociate into its constituent components to provide dissociated metal bonded to the ceramic substrate upon application of laser energy. Laser energy in then applied to predetermined areas of the surface of the nonconductive ceramic substrate to provide dissociated metallic conductors in the predetermined areas. The disclosed process further includes the formation of metallized through holes by application of laser energy to the nonconductive ceramic substrate to form a through hole, whereby dissociated metal in formed on the inside of the through hole. The disclosed process also includes the capability to down trim a thick film or thin film resistor which is conductively coupled between two areas of metallization. Laser energy is applied to a portion of the thick film or thin film resistor and to a portion of the metallic nonconductive ceramic substrate in a predetermined pattern to provide a continuous dissociated metallic conductor which passes through the thick film or thin film resistor and is conductively connected to one of two areas of electrically conductive metallization.
REFERENCES:
patent: 4321073 (1982-03-01), Blair
patent: 4490210 (1984-12-01), Chen et al.
patent: 4694138 (1987-09-01), Oodaira et al.
patent: 4715117 (1987-12-01), Enomoto
patent: 4732780 (1988-03-01), Mitoff et al.
Root Randolph E.
Vu Thanh T.
Corbin John K.
Float Kenneth W.
Gudmestad Terje
Hughes Aircraft Company
Karambelas A. W.
LandOfFree
Induced metallization process by way of dissociating aluminum ni does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Induced metallization process by way of dissociating aluminum ni, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Induced metallization process by way of dissociating aluminum ni will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-169582