Induced flow heat exchanger

Heat exchange – With impeller or conveyor moving exchange material – Mechanical gas pump

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165 803, 165128, 361384, F28F 1306

Patent

active

046289925

ABSTRACT:
In order to cool heat generating components on an electronic assembly without contamination by particles carried in a cooling gas stream, a cold plate is disposed adjacent the assembly, defining a gap region therebetween. The cooling gas is directed in proximity to the cold plate, dissipating heat transferred from the components to the plate. To enhance overall heat dissipation of the apparatus, an aperture is defined between the gap region and the gas stream, so that a negative pressure is induced in the gap by virtue of the Bernoulli principle. This pressure difference induces convection within the gap, increasing heat flow between the components and the plate, and resulting in overall improvement in heat dissipation. Embodiments in which the gas stream flow is parallel and transverse to the cold plate are described.

REFERENCES:
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patent: 3196940 (1965-07-01), Saslow et al.
patent: 4093021 (1978-06-01), Groom
patent: 4103737 (1978-08-01), Perkins
patent: 4277816 (1981-07-01), Dunn et al.
patent: 4291364 (1981-09-01), Andros et al.
patent: 4296455 (1981-10-01), Leaycraft et al.
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patent: 4393437 (1983-07-01), Bell et al.
patent: 4399485 (1983-08-01), Wright et al.
patent: 4415023 (1983-11-01), Vandervaart
patent: 4417295 (1983-11-01), Stuckert
"Cold Plate with Metal Base and Molded Plastic Shell for Circuit Module", IBM Technical Disclosure Bulletin, vol. 24, No. 8, Jan. 1982, by K. P. Moran and D. D. Stenabaugh.

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