Individually powering-up unsingulated dies on a wafer

Details Individually powering-up unsingulated dies on a wafer Individually powering-up unsingulated dies on a wafer

1992-07-02

1995-02-14

Kunemund, Robert

Fishing, trapping, and vermin destroying

148DIG28, 371214, 371216, G01R 3126

Patent

active

053895568

ABSTRACT:
A plurality of unsingulated dies on a wafer may be individually powered up using various "electronic mechanisms" on the wafer, and connecting the electronic mechanisms to the individual dies by conductive lines on the wafer. The electronic mechanisms are capable of powering-up a single die or groups of the dies, and electronically "walking through" the entire plurality of unsingulated dies. Redundant conductive lines may be provided. Diodes and/or fuses may be provided in conjunction with the conductive lines, to protect against various faults which may occur in the conductive lines. Redundant electronic selection mechanisms may also be provided to ensure the ability to selectively power up the dies.

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