Individual wafer history storage for overlay corrections

Details Individual wafer history storage for overlay corrections Individual wafer history storage for overlay corrections

2006-08-03

2010-10-05

Glick, Edward J (Department: 2882)

Photocopying

Projection printing and copying cameras

Step and repeat

C355S052000

Reexamination Certificate

active

07808613

ABSTRACT:
The invention relates to a device manufacturing method comprising identifying a substrate to be processed, performing a manufacturing step of a patterned layer on the substrate, and storing a substrate process history for the substrate. The history may comprise a correction map comprising position errors caused by the manufacturing step. Identifying the substrate may be done by reading an identification sign present on the substrate or by reading an identification code of a lot comprising the substrate and determining a sequence number of the substrate in the lot. Alignment of the substrate with respect to a patterning device of a lithographic apparatus may be corrected using information of the substrate process history. Alternatively or additionally, measured overlay errors may be corrected per substrate using information of the substrate process history.

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