Measuring and testing – Specimen stress or strain – or testing by stress or strain... – By loading of specimen
Patent
1979-12-20
1981-08-11
Myracle, Jerry W.
Measuring and testing
Specimen stress or strain, or testing by stress or strain...
By loading of specimen
G01N 308
Patent
active
042827582
ABSTRACT:
A method for destructive testing of the bond strength of each individual d of a chip beam-lead device which includes cutting the chip using a laser, laser cutting a hole through each individual piece of the chip with the lead attached to the chip and inserting a hook of a pull tester into the hole made in each chip section and pulling the chip section and the lead attached thereto to determine the bond strength between the lead of the chip and the conductor to which the lead is attached.
REFERENCES:
patent: 3564911 (1971-02-01), Slemmons et al.
patent: 3572108 (1971-03-01), McShane et al.
patent: 3945248 (1976-03-01), West
Herron, Jr. Jake
Wootten Richard M.
Deaton James T.
Edelberg Nathan
Gibson Robert P.
Myracle Jerry W.
The United States of America as represented by the Secretary of
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