Individual lead pull test for beam leaded devices

Measuring and testing – Specimen stress or strain – or testing by stress or strain... – By loading of specimen

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G01N 308

Patent

active

042827582

ABSTRACT:
A method for destructive testing of the bond strength of each individual d of a chip beam-lead device which includes cutting the chip using a laser, laser cutting a hole through each individual piece of the chip with the lead attached to the chip and inserting a hook of a pull tester into the hole made in each chip section and pulling the chip section and the lead attached thereto to determine the bond strength between the lead of the chip and the conductor to which the lead is attached.

REFERENCES:
patent: 3564911 (1971-02-01), Slemmons et al.
patent: 3572108 (1971-03-01), McShane et al.
patent: 3945248 (1976-03-01), West

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