Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1998-02-11
2000-05-30
Lund, Jeffrie R
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
216 13, H01B 1300
Patent
active
060687827
ABSTRACT:
A method of fabricating individual, embedded capacitors in multilayer printed circuit boards is disclosed. The method is compatible with standard printed circuit board fabrication. The capacitor fabrication is based on a sequential build-up technology employing a first patternable insulator. After patterning of the insulator, pattern grooves are filled with a high dielectric constant material, typically a polymer/ceramic composite. Capacitance values are defined by the pattern size, thickness and dielectric constant of the composite. Capacitor electrodes and other electrical circuitry can be created either by etching laminated copper, by metal evaporation or by depositing conductive ink.
REFERENCES:
patent: 4065742 (1977-12-01), Kendell et al.
patent: 4409608 (1983-10-01), Yoder
patent: 4437140 (1984-03-01), Ohyama et al.
patent: 4460938 (1984-07-01), Clei
patent: 4490429 (1984-12-01), Tosaki et al.
patent: 4650544 (1987-03-01), Erb et al.
patent: 4878155 (1989-10-01), Conley
patent: 4908258 (1990-03-01), Hernandez
patent: 5010641 (1991-04-01), Sisler
patent: 5027253 (1991-06-01), Lauffer et al.
patent: 5065284 (1991-11-01), Hernandez
patent: 5079069 (1992-01-01), Howard et al.
patent: 5155655 (1992-10-01), Howard et al.
patent: 5161086 (1992-11-01), Howard et al.
patent: 5162977 (1992-11-01), Paurus et al.
patent: 5261153 (1993-11-01), Lucas
patent: 5347258 (1994-09-01), Howard et al.
patent: 5656834 (1997-08-01), Grzyb et al.
Brandt Lutz W.
Gandhi Pradeep R.
Matijasevic Goran
Lund Jeffrie R
Ormet Corporation
Reiter Stephen E.
Stewart Ramsey R.
LandOfFree
Individual embedded capacitors for laminated printed circuit boa does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Individual embedded capacitors for laminated printed circuit boa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Individual embedded capacitors for laminated printed circuit boa will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1907877