Indium-containing, low silver copper-base filler metal

Details Indium-containing, low silver copper-base filler metal Indium-containing, low silver copper-base filler metal

1975-08-14

1976-08-31

Stallard, W.

Specialized metallurgical processes, compositions for use therei

Processes

Free metal or alloy reductant contains magnesium

751575, 75160, 228263, C22C 904

Patent

active

039778690

ABSTRACT:
A filler metal composition and method are provided for producing strong brazed joints between metal parts, e.g. steel parts, assembled in joint-forming relationship with each other, the filler metal comprising an indium-containing, low silver, copper base brazing alloy consisting essentially by weight of about 0.5% to 15% Ag, about 1% to 14% In, about 50% to 85% Cu, up to about 0.6% Si and the balance essentially zinc.

REFERENCES:
patent: 2235634 (1941-03-01), Hensel et al.
patent: 2355067 (1944-08-01), Goldsmith
patent: 3091527 (1963-05-01), Pollock
patent: 3841921 (1974-10-01), Shapiro et al.

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