Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1984-12-20
1986-03-04
Godici, Nicholas P.
Metal fusion bonding
Process
With condition responsive, program, or timing control
2281802, 228 9, 228 12, 228 447, 228 494, B23K 2000, B23K 3102
Patent
active
045736278
ABSTRACT:
In order to ensure total bonding together of two-dimensional arrays of inm bumps on circuit boards, additional bumps are placed on each board in a triangular pattern which contains the array of that board. Opposing sets of thrusters are used to move the boards and their bumps toward each other, after the arrays are aligned with the boards juxtaposed and substantially parallel to each other. As corresponding sets of additional bumps touch each other, the set of thrusters moving the boards at those points hold their positions, until all sets of additional bumps are in touch; all of the thrusters of at least one board are then simultaneously energized until a predetermined pressure is achieved between the boards.
REFERENCES:
patent: 3580460 (1971-05-01), Lipshutz
patent: 3669333 (1972-06-01), Coucoulas
patent: 3698620 (1972-10-01), Geyer
patent: 3871015 (1975-03-01), Lin
patent: 3887998 (1975-06-01), Hartleroad
patent: 4184623 (1980-01-01), Strasser
Dunn Aubrey J.
Miller Brian S.
Dunn Aubrey J.
Godici Nicholas P.
Harwell Max L.
Lane Anthony T.
McKee C.
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