Indium alloy cold weld bumps

Details Indium alloy cold weld bumps Indium alloy cold weld bumps

1992-06-25

1993-02-16

Ramsey, Kenneth J.

Metal fusion bonding

Process

Using only pressure

2281802, H01L 2198

Patent

active

051863790

ABSTRACT:
An improved method for indium bonding of surfaces comprising forming indium bumps on a first surface, such as a semiconductor chip. An alloying metal which forms a primary-intermetallic-free alloy with indium is provided on a second surface, such as a substrate to be connected to the pad of the semiconductor chip. The pad and substrate are cold welded at 2000 to 6000 pounds per square inch (1.0.times.10.sup.5 to 3.1.times.10.sup.5 mm Hg) to form indium alloy bonds having improved strength, reliability, and toughness.

REFERENCES:
patent: 4067104 (1978-01-01), Tracy
patent: 4159075 (1979-06-01), Ljung et al.
patent: 4431711 (1984-02-01), Eisfeller
patent: 4740700 (1988-04-01), Shaham et al.
patent: 4817850 (1989-04-01), Wiener-Avnear
patent: 4865245 (1989-09-01), Schulte et al.
patent: 4930001 (1990-05-01), Williams

Affiliated with

Also associated with

Rating

Indium alloy cold weld bumps does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Indium alloy cold weld bumps, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Indium alloy cold weld bumps will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2143132