Indirect stimulation of an integrated circuit die

Details Indirect stimulation of an integrated circuit die Indirect stimulation of an integrated circuit die

2005-03-22

2005-03-22

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S750010, C324S765010

Reexamination Certificate

active

06870379

ABSTRACT:
Analysis of a semiconductor die is enhanced by the stimulation the die and the detection of a response to the stimulation. According to an example embodiment of the present invention, a semiconductor die is analyzed using indirect stimulation of a portion of the die, and detecting a response therefrom. First, selected portion of circuitry within the die is stimulated. The stimulation of the selected portion induces a second portion of circuitry within the die to generate an external emission. The emission is detected and the die is analyzed therefrom. In one particular implementation, a response from the selected portion is inhibited from interfering with the detection of the emission from the second portion of circuitry.

REFERENCES:
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patent: 6122042 (2000-09-01), Wunderman et al.
patent: 6387715 (2002-05-01), Davis et al.
patent: 6417680 (2002-07-01), Birdsley et al.
patent: 6529018 (2003-03-01), Stevens
patent: 6545490 (2003-04-01), Bruce
patent: 6599762 (2003-07-01), Eppes

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