Indirect monitoring of semiconductor light source within a...

Radiant energy – Photocells; circuits and apparatus – Housings

Reissue Patent

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C250S216000, C257S432000, C257S433000

Reissue Patent

active

RE042845

ABSTRACT:
A photonic package includes a housing having a semiconductor light source disposed within the housing. The semiconductor light source has a first output and a second output. A reflective surface is disposed inside the housing to reflect the second output from the semiconductor light source. A photodetector is also disposed within the housing and is adapted to indirectly receive the second output of the semiconductor light source reflected off the reflective surface. As a result, interior surface of a housing of an optical transponder may be utilized to provide reflected light to a photodetector to monitor the semiconductor light source.

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