Etching a substrate: processes – Adhesive or autogenous bonding of two or more...
Patent
1994-09-20
1996-10-29
Powell, William
Etching a substrate: processes
Adhesive or autogenous bonding of two or more...
216100, B44C 122, C23C 100
Patent
active
055693911
ABSTRACT:
An indirect cathode sleeve and manufacturing method thereof capable of substantially reducing electric power consumption of a heater disposed inside the cathode sleeve and simultaneously reducing a picture-producing time by oxidizing an inside surface of the cathode sleeve and reducing an outside surface thereof. The cathode sleeve includes a heater disposed inside the cathode sleeve; a base metal formed at the top of the cathode sleeve; an electron-emitting material layer formed at the outside surface of the base metal; and an indirect cathode sleeve including a black inside surface and a white outside surface. The method for manufacturing the indirect cathode sleeve includes the steps of forming a structure of a cathode sleeve consisting of a bimetal which consist of a Nickel-Chrome alloy at an inside surface of the cathode sleeve and a Nickel alloy at an outside surface of the cathode sleeve; oxidizing the inside surface of the cathode sleeve through a high temperature wet hydrogen environment; selectively etching the outside surface of the cathode sleeve and, as a result, forming a base metal at the top of the cathode sleeve; and forming an electron-emitting material layer at the outside surface of the base metal.
REFERENCES:
patent: 3419744 (1968-12-01), Kerstetter
patent: 3535757 (1970-10-01), Nestleroth et al.
patent: 4376009 (1983-03-01), Kunz
patent: 4441957 (1984-04-01), Poff et al.
patent: 4849066 (1989-07-01), Deal et al.
"One-Piece Bimetal Cathode Cup and Sleeve", John Coryell Turnbull, RCA Technical Notes, Princeton, NJ, USA, Jul. 23, 1976, TN No: 1159.
Jung Gil Y.
Ko Byeong D.
Lee Kyeong S.
Park Gong S.
Park Hun G.
Goldstar Co. Ltd.
Powell William
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