Index mounting unitary heat sink apparatus with apertured base

Details Index mounting unitary heat sink apparatus with apertured base Index mounting unitary heat sink apparatus with apertured base

1975-10-14

1977-10-18

James, Andrew J.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

357 72, 165 80, 174 16HS, H01L 2302, H01L 2328

Patent

active

040549011

ABSTRACT:
Disclosed is a unitary heat sink apparatus in the form of a U-shaped body of thermally conductive material adapted for use in connection with semiconductor device packages having a thermally conductive transfer plate adjacent one major face of the device package. Typical of such device packages is the TO-220 plastic power package. One leg of the U-shaped clip urges the thermal transfer plate into intimate contact with a flat portion of the opposite leg by the spring action provided by the base of the U. An aperture in the base of the U allows the leads to extend from the heat sink. Fins are included on one leg of the heat sink and means for attaching the heat sink apparatus to printed circuit boards are also disclosed.

REFERENCES:
patent: 2541828 (1951-02-01), Peck
patent: 3047648 (1962-07-01), Mowatt
patent: 3548927 (1970-12-01), Spurling
patent: 3694703 (1972-09-01), Wilens
patent: 3783347 (1974-01-01), Vladik
patent: 3893161 (1975-07-01), Pesak

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