Incremented rotated wafer placement on electro-static chucks for

Details Incremented rotated wafer placement on electro-static chucks for Incremented rotated wafer placement on electro-static chucks for

1997-10-07

1998-12-01

Krizek, Janice L.

Material or article handling

Article reorienting device

414936, 437225, B65G 4724

Patent

active

058428259

ABSTRACT:
A method of orienting wafers in an apparatus having a wafer receiving-workpiece holder such as an electro-static chuck for processing of the wafers and eliminating etch debris build-up at the wafer orienting notch. The method comprises the steps of first providing a plurality of wafers, each wafer having an orientation mark thereon and then securing a first wafer in the chuck with the first wafer orientation mark in a first position with respect to the chuck. Thereafter, the first wafer is removed from the chuck after desired processing of the first wafer. A subsequent wafer is secured in the chuck with the subsequent wafer orientation mark in a second position with respect to the chuck different than the first position. The position of the subsequent wafer orientation mark may be rotated a predetermined desired degree with respect to the position of the first wafer orientation mark, for example, between about 1 and 30 degrees with respect to the position of the first wafer orientation mark, more preferably between about 4 and 9 degrees. Alternatively, the position of the subsequent wafer orientation mark may be rotated a random degree with respect to the position of the first wafer orientation mark.

REFERENCES:
patent: 5102280 (1992-04-01), Poduje et al.
patent: 5207437 (1993-05-01), Barnes et al.
patent: 5308222 (1994-05-01), Bacchi et al.
patent: 5365672 (1994-11-01), Kato
patent: 5511934 (1996-04-01), Bacchi et al.
patent: 5513948 (1996-05-01), Bacchi et al.
patent: 5535090 (1996-07-01), Sherman

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