Increasing thermal conductivity of thermal interface using...

Details Increasing thermal conductivity of thermal interface using... Increasing thermal conductivity of thermal interface using...

2005-05-10

2005-05-10

Thompson, Gregory D. (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080200, C165S185000, C174S016300, C361S707000, C361S708000, C361S718000, C361S719000, C361S722000, C428S216000, C428S408000

Reexamination Certificate

active

06891724

ABSTRACT:
The invention relates to a structure of and a process of forming an integrated circuit package that utilizes a thermal interface material layer having an aligned array of carbon nanotubes affixed to a surface of the layer. The thermal interface material is diamond deposited by chemical vapor deposition. The carbon nanotubes are formed by a plasma discharge process on the surface of the CVDD and also may be formed on the surface of the die.

REFERENCES:
patent: 5316080 (1994-05-01), Banks et al.
patent: 5604037 (1997-02-01), Ting et al.
patent: 5825624 (1998-10-01), Arnold et al.
patent: 5837081 (1998-11-01), Ting et al.
patent: 5965267 (1999-10-01), Nolan et al.
patent: 6407922 (2002-06-01), Eckblad et al.
patent: 6504292 (2003-01-01), Choi et al.
patent: 6651736 (2003-11-01), Chiu et al.
patent: 20020105071 (2002-08-01), Mahajan et al.
patent: 20030135971 (2003-07-01), Liberman et al.
patent: 20030179559 (2003-09-01), Engelhardt et al.
patent: 20040150100 (2004-08-01), Dubin et al.
patent: 0538798 (1993-04-01), None
patent: 0689244 (1995-12-01), None
US 2003/0117770 Montgomery et al “Carbon Nanotube Thermal Interface Structures”, Jun. 2003.*
“High Conduction Thermal Interface Material”,IBM Technical Disclosure Bulletin, 36 (10), IBM Corp., NY, US, (1993), 581-583.

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