Increase productivity at wafer test using probe retest data...

Details Increase productivity at wafer test using probe retest data... Increase productivity at wafer test using probe retest data...

2007-08-07

2007-08-07

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S765010, C324S073100

Reexamination Certificate

active

10709729

ABSTRACT:
Disclosed is a method and system for testing integrated circuit devices after manufacture wherein, an initial group of devices is tested to produce an initial failing group of devices that failed the testing. The devices in the initial failing group are identified by type of failure. Then, the devices in the initial failing group are retested to identify a retested passing group of devices that passed the retesting. Next, the devices in the retested passing group are analyzed to produce statistics regarding the likelihood that a failing device that failed the initial testing will pass the retesting according to the type of failure. Then, these statistics are evaluated to determine which types of failures have retest passing rates above a predetermined threshold. From this, a database is produced that includes an optimized retest table listing the types of defects that are approved for retesting.

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