Metal founding – Process – Shaping liquid metal against a forming surface
Patent
1995-06-07
1998-07-07
Lin, Kuang Y.
Metal founding
Process
Shaping liquid metal against a forming surface
164 97, 164113, B22D 1710, B22D 1902, B22D 1914
Patent
active
057754039
ABSTRACT:
A method of fabricating MMCs having high thermal conductivity coupled with coefficient of thermal expansion (CTE) values which approximates the CTE of ceramics and semi-conductor materials typically used in electronic packaging. The method comprises preparing a formed agglomeration of powder particles (preform); partially sintering the preform; placing the partially sintered preform into a forming chamber; infiltrating the preform with liquid-phase metal; and allowing the liquid-phase metal to solidify and form an MMC around and through the preform. In a preferred embodiment, the preform is constructed from silicon carbide, and the metal matrix is an aluminum-silicon alloy.
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Derkacy James A.
Phelps Frankie E.
Premkumar M. K.
Sawtell Ralph R.
Yun David I.
Aluminum Company of America
Beiriger Tracey D.
Levine Edward L.
Lin Kuang Y.
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