Stock material or miscellaneous articles – Composite – Of silicon containing
Reexamination Certificate
2001-10-11
2004-03-16
Dawson, Robert (Department: 1712)
Stock material or miscellaneous articles
Composite
Of silicon containing
C428S413000, C428S414000, C428S416000, C428S447000, C428S448000, C428S473500, C428S502000, C428S901000, C528S012000, C528S033000, C528S043000, C524S436000, C524S437000, C525S474000, C525S476000
Reexamination Certificate
active
06706409
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an incombustible resin composition, and a prepreg, a laminated plate, a metal-clad laminated plate, a printed wiring board and a multi-layer printed wiring board using the same, which are suitably used for a variety of electronic materials.
2. Description of the Related Art
Upon most of resin compositions used for a variety of electronic devices, incombustibility is conferred in order to secure the safety involving with fire. In order to make the resin compositions incombustible, a variety of methods have been employed, and bromine compounds have been widely used because of their excellent incombustibility.
However, there is a possibility that the bromine compounds may form a compound having a high toxicity. Moreover, since people become highly conscious about the environmental destructive problems on a global scale, incombustible systems in place of bromine compound being considered.
On the other hand, as a soldering material of mounted parts, conventionally Sn—Pb based soldering materials have been mainly used. Since these may pollute the soil at the time of processing disposables, a soldering material without using Pb is considered. When analyzing the reports concerned with soldering materials free from Pb, the melting point rises, and therefore it is conceivable that the reflow temperature would also rise.
Under such circumstances, for resin compositions used for electronic materials from now on, where bromine compounds are not used, and at the same time, a higher heat-resistance than those of resin compositions made so far is required.
As a method of making materials incombustible in place of bromine compounds, conventionally, an addition of phosphorous and nitrogenous compounds and an introduction of these into the resin skeletons have been performed. These have been disclosed, for example, in Japanese Patent Application (Japanese Patent Application Laid-Open No. Hei 11-124489) filed on Oct. 22, 1997 and Japanese Patent Application (Japanese Patent Application Laid-Open No. Hei 11-199753) filed on Jan. 5, 1998. In order to secure the incombustibility using phosphorus and nitrogen, these are required to some extent to be blended.
However, when these are blended so that incombustibility can be secured, there have been problems such as the increase in the water absorption rate, the decrease in heat resistance, and the like occur.
As a method of making the material incombustible in which the volume of introduction of phosphorus and nitrogen are reduced, there is a method of using metal hydrates.
For example, in Japanese Patent Application (Japanese Patent Application Laid-Open No. Hei 11-181243) filed on the date of Dec. 18, 1997, a technology of making the material incombustible using hydration alumina has been disclosed.
However, since metal hydrates trap water having the cooling effect at the time of burning, there has been a problem that when the volumes of these are blended to some extent, the heat resistance is rapidly lowered.
The reason for the heat resistances decreasing when the metal hydrates are used is that the temperature at which the metal hydrates release water is lower than the melting temperature of the soldering.
This tendency is considered to be more significant in the case of the soldering being free from Pb whose melting temperature is expected to rise to a higher point.
As a method of enhancing the heat resistance using metal hydrates, a method of using magnesium hydroxide whose temperature of releasing water is comparatively high (approximately 340° C.) has been disclosed in Japanese Patent Application (Japanese Patent Application Laid-Open No. Hei 11-181305) filed on Jul. 6, 1999.
However, there has been a problem that magnesium hydroxide is inferior from the viewpoint of the acid resistance. Moreover, a method of performing silane processing with silane compound monomer to the surface of the metal hydrate for the purpose of enhancing dispersion of the metal hydrate, the tensile strength, the elongation has been disclosed in Japanese Patent Application (Japanese Patent Application Laid-Open No. Hei 11-181380) filed on Jul. 6, 1999 and Japanese Patent Application (Japanese Patent Application Laid-Open No. Hei 11-217467) filed on Feb. 3, 1998.
However, as for the silane compound monomer, the enhancement of the heat resistance of the metal hydrate was not recognized because it is also accompanied with the facts that the heat resistance of the monomer itself is low and the processing efficiency to the surface of the metal hydrate is low.
SUMMARY OF THE INVENTION
An object of the present invention is to provide an incombustible resin composition, a laminated plate and a printed wiring board, where heat resistance is high and which does not require the bromine compounds.
One aspect of the present invention provides an incombustible resin composition, which comprises a silicon oligomer, a metal hydrate and a resin material as essential components, wherein the metal hydrate is at least 20% by weight in the total solids of the resin composition.
The term “total solids” as used herein relates to inorganic filler, resins, and hardening agents and hardening accelerators arbitrarily selected.
Another aspect of the present invention provides an incombustible composition containing at least one species of resin material selected from the group consisting of an epoxy resin, a polyimide resin, a triazine resin, a phenol resin, a melamine resin and the denatured resins denaturing these resins.
Further, the present invention provides an incombustible resin composition where the metal hydrate has a surface processed with a silicone oligomer.
Further, the present invention provides an incombustible resin composition containing aluminium hydroxide as the metal hydrate.
Further, the present invention provides an incombustible resin composition where the average particle diameter of aluminium hydroxide is 5 &mgr;m or less.
Further, the present invention provides an incombustible resin composition containing magnesium hydroxide as a metal hydrate.
Further, the present invention provides an incombustible resin composition containing calcium hydroxide as a metal hydrate.
Further, the present invention provides an incombustible resin composition where the end of the silicone oligomer has a silanol group capable of reacting with the surface of the metal hydrate.
Further, the present invention provides an incombustible resin composition where which the degree of polymerization of silicon oligomer is 2 to 7000.
Further, the present invention provides an incombustible resin composition where the silicone oligomer contains aromatic group.
Further, the present invention provides an incombustible resin composition where each siloxane unit of the silicone oligomer contains one aromatic group or more, respectively.
Further, the present invention provides a prepreg manufactured by utilizing an incombustible resin composition, a laminated plate manufactured by utilizing the prepreg, a metal-clad laminated plate manufactured by utilizing the laminated plate and a printed wiring board prepared by utilizing the metal-clad laminated plate.
Another aspect of the present invention provides a method for preparing an incombustible resin composition, which comprises: a metal hydrate is mixed into a processing solution containing a silicone oligomer; and then other resin components are mixed into the solution.
Further, the present invention provides an incombustible resin composition using aluminium hydroxide as a metal hydrate.
By utilizing an incombustible resin composition of the present invention, a prepreg, a laminated plate, a copper-clad laminated plate, a printed wiring board and a multi-layer wiring board, which has been desired in recent years, has an excellent incombustibility without using bromine and realizes a high heat resistance can be prepared.
The present disclosure relates to subject matter contained in Japanese Patent Application No.2000-313720, filed on Oct. 13, 2000, the disclosure of which
Fukuda Tomio
Miyatake Masato
Takano Nozomu
Dawson Robert
Feely Michael J
Greenblum & Bernstein P.L.C.
Hitachi Chemical Co. Ltd.
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