Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2006-11-14
2006-11-14
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Reexamination Certificate
active
07135382
ABSTRACT:
Disclosed is a method of in-wafer testing of integrated optical components and in-wafer chips with photonic integrated circuits (PICs).
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Joyner Charles H.
Kish, Jr. Fred A.
Missey Mark J.
Nagarajan Radhakrishnan L.
Peters Frank H.
Carothers, Jr. W. Douglas
Infinera Corporation
Lebentritt Michael
Stevenson Andre′ C.
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