In situ RF shield for printed circuit board

Details In situ RF shield for printed circuit board In situ RF shield for printed circuit board

1991-08-19

1993-01-05

Picard, Leo P.

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

174 35MS, 361401, 361424, H05K 900

Patent

active

051773244

ABSTRACT:
A printed circuit board providing RF shielding. An electrically insulating material serves as a substrate (10) with two opposed sides. At least one side of the substrate (10) has an electrically conductive layer (12) formed in a pattern that defines a printed circuit. An insulating dielectric layer (14) covers at least a portion of the printed circuitry, leaving at least one portion (16) of the circuitry exposed. A radio frequency (RF) shielding layer (18) is formed by depositing an electrically conductive polymer on at least a portion of the insulating dielectric layer. The RF shielding layer (18) also lies over a portion of the exposed electrical circuitry (16), providing electrical connection to the electrically conductive layer (12). The RF shielding layer (18) is formed from a silverfilled polymer thick film ink and is applied by screen printing, stencilling, roller coating, spraying, or other equivalent methods.

REFERENCES:
patent: 4626963 (1986-12-01), Speer
patent: 4633122 (1986-12-01), Radice
patent: 4801489 (1989-01-01), Nakagawa et al.
patent: 4912604 (1990-03-01), Vaisanen
patent: 4979019 (1990-12-01), Paquette et al.
patent: 5028743 (1991-07-01), Kawakami et al.

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