In situ resist control during spray and spin in vapor

Details In situ resist control during spray and spin in vapor In situ resist control during spray and spin in vapor

1992-10-30

1994-11-22

Bell, Janyce

Coating processes

Measuring, testing, or indicating

Thickness or uniformity of thickness determined

427 10, 427240, 427325, 4273855, 118 52, 118668, B05D 312

Patent

active

053667573

ABSTRACT:
Spin coating of resist on a semiconductor wafer is done in a controlled chamber, starting with introducing a resist solvent vapor into the chamber from a nozzle, applying the resist by spraying a very thin layer of the resist material, monitoring and adjusting the resist thickness during spinning in vapor, and then removing solvent from the chamber. The result is a saving in resist material and enhanced coating uniformity.

REFERENCES:
patent: 4290384 (1981-09-01), Ausschnitt et al.
patent: 4416213 (1983-11-01), Sakiya
patent: 4800836 (1989-01-01), Yamamoto et al.
patent: 5045417 (1991-09-01), Okamoto
patent: 5250116 (1993-10-01), Tanimoto

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