Semiconductor device manufacturing: process – Having organic semiconductive component
Reexamination Certificate
2007-12-25
2007-12-25
Elms, Richard T. (Department: 2824)
Semiconductor device manufacturing: process
Having organic semiconductive component
C257S040000, C365S151000, C365S153000, C977S896000, C977S943000
Reexamination Certificate
active
10837028
ABSTRACT:
This invention pertains to methods assembly of organic molecules and electrolytes in hybrid electronic. In one embodiment, a method is provided that involves contacting a surface/electrode with a compound of formula: R-L2-M-L1-Z1where Z1is a surface attachment group; L1and L2are independently linker or covalent bonds; M is an information storage molecule; and R is a protected or unprotected reactive site or group; where the contacting results in attachment of the redox-active moiety to the surface via the surface attachment group; and ii) contacting the surface-attached information storage molecule with an electrolyte having the formula: J-Q where J is a charged moiety (e.g., an electrolyte); and Q is a reactive group that is reactive with the reactive group (R) and attaches J to the information storage molecule thereby patterning the electrolyte on the surface.
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Bocian David F.
Kuhr Werner G.
Lindsey Jonathan S.
Misra Veena
Beyer & Weaver, LLP
Elms Richard T.
Hunter Tom
Lulis Michael
The North Carolina State University
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