In-situ multiprobe retest method with recovery recognition

Details In-situ multiprobe retest method with recovery recognition In-situ multiprobe retest method with recovery recognition

1998-01-15

2000-03-28

Dutton, Brian

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Electrical characteristic sensed

438 17, 324754, 209573, H01L 2166, G01R 3126, B07C 5344

Patent

active

060431016

ABSTRACT:
This invention is a test methodology that immediately retests failed chips to recover false tester reads with no loss of test floor capacity during multiprobe production testing of integrated circuit chips on a wafer. This method retests a chip a second time prior to the multiprobe going to the next chip on the wafer, thus eliminating lost time in repositioning the multiprobe.

REFERENCES:
patent: 5927512 (1999-07-01), Beffa
patent: 5943552 (1999-08-01), Koveshnikov et al.

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