In situ method for metalizing a semiconductor catalyst

Details In situ method for metalizing a semiconductor catalyst In situ method for metalizing a semiconductor catalyst

1996-04-30

1998-11-10

Radgett, Marianne

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

427581, 427584, 427197, 427199, 427205, 427217, 4221863, B05D 0306, C23C 1648, B01J 1908

Patent

active

058340696

ABSTRACT:
A semiconductor catalyst is metalized in situ on a reaction support surface by illuminating at least a portion of the catalyst in the presence of a suitable source of metal to selectively deposit the metal on the illuminated portions. The source of metal can be applied to the reaction support surface either with the catalyst or separately, but is not attached to the catalyst until the structure is illuminated. This causes the metal to be deposited where the catalyst will be illuminated during use and therefore where photopromoted catalytic degradation can occur.

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