Measuring and testing – Vibration – By mechanical waves
Patent
1997-11-20
2000-02-01
Williams, Hezron
Measuring and testing
Vibration
By mechanical waves
73622, 73624, 73625, G01N 924
Patent
active
060190000
ABSTRACT:
A system is disclosed that employs ultrasonic waves to perform in-situ measurements to determine the properties of films deposited on substrates in the course of various semiconductor or processing steps. In one embodiment a single transducer excites incident acoustic waves at multiple frequencies that reflect from the films. The reflected waves are received by the same transducer. An analysis system determines the phase shift of the received reflected waves and, based on the phase shift, determines the film properties. Other embodiments employ distinct source and receiving transducers. Embodiments are also disclosed that compensate the measured phase shift for temperature variations in the substrate. In one such system, temperature compensation is performed based on the processing of phase measurements made at multiple frequencies or incidence angles or with multiple ultrasonic modes. The disclosed techniques are equally applicable to determining the degree of erosion of chamber members.
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Degertekin Fahrettin Levent
Khuri-Yakub Butrus T.
Pham Hung
Stanke Fred E
Sensys Instruments Corporation
The Board of Trustees of the Leland Stanford Junior University
Tran Thuy Vinh
Williams Hezron
LandOfFree
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