In-situ laser patterning of thin film layers during sequential d

Details In-situ laser patterning of thin film layers during sequential d In-situ laser patterning of thin film layers during sequential d

1996-07-22

1998-10-20

Padgett, Marianne

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

427556, 216 65, 216 94, 21912169, 205136, B05D 300

Patent

active

058243747

ABSTRACT:
The present invention involves in situ laser patterning of thin-film layers during sequential deposition of the different layers. The layers may be applied using any known method of film deposition. The method of the present invention involves laser ablation to remove unwanted portions of the coating layers, including color filter materials, that have been sequentially deposited onto substantially the entire surface of a substrate. By controlling the depth of the laser ablation removal of the deposited films, it is possible to remove any portion of a film or layers of films or coatings that have been sequentially coated onto the surface of the substrate and to thereby control the depth and location of color filter materials coated upon the substrate. This patterning process can be employed in conjunction with any film deposition technique known in the art, including vacuum, wet chemical or dry processing deposition techniques, but is preferred with vacuum deposition. Because both the coating and the selective removal of the coatings by laser ablation can be performed without breaking vacuum, in the case of vacuum deposition, the process greatly simplifies and increases the rate of production of coated arrays, including color filter arrays. In addition, this method allows for the construction of complex pattern, thin film structures without the need for masking encountered with other patterning processes.

REFERENCES:
patent: Re31280 (1983-06-01), Yano et al.
patent: 4508749 (1985-04-01), Brannon et al.
patent: 4786358 (1988-11-01), Yamazaki et al.
patent: 5054894 (1991-10-01), Warszawski
patent: 5056899 (1991-10-01), Warszawski
patent: 5061341 (1991-10-01), Kildal et al.
patent: 5076673 (1991-12-01), Lynam et al.
patent: 5169678 (1992-12-01), Cole et al.
patent: 5215864 (1993-06-01), Laakmann
patent: 5281450 (1994-01-01), Yaniv
patent: 5302423 (1994-04-01), Tran et al.
patent: 5340619 (1994-08-01), Chen et al.
patent: 5407557 (1995-04-01), Iida et al.
patent: 5446577 (1995-08-01), Bennett et al.
IBM Tech. Discl. Bull., "Debris Elimination following laser Ecthing", vol. 33, No. 9, Feb. 1991.
Ziegler et al, "Flat Panel Display Technology," The Electrochemical Society Interface, (Summer 1994) No month.

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