In-situ endpoint detection and process monitoring method and app

Details In-situ endpoint detection and process monitoring method and app In-situ endpoint detection and process monitoring method and app

1993-12-22

1995-07-18

Kisliuk, Bruce M.

Abrading

Precision device or process - or with condition responsive...

By optical sensor

1566361, 216 88, B24B 4900

Patent

active

054336511

ABSTRACT:
An in-situ chemical-mechanical polishing process monitor apparatus for monitoring a polishing process during polishing of a workpiece in a polishing machine, the polishing machine having a rotatable polishing table provided with a polishing slurry, is disclosed. The apparatus comprises a window embedded within the polishing table, whereby the window traverses a viewing path during polishing and further enables in-situ viewing of a polishing surface of the workpiece from an underside of the polishing table during polishing as the window traverses a detection region along the viewing path. A reflectance measurement means is coupled to the window on the underside of the polishing table for measuring a reflectance, the reflectance measurement means providing a reflectance signal representative of an in-situ reflectance, wherein a prescribed change in the in-situ reflectance corresponds to a prescribed condition of the polishing process.

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Research Disclosure, Aug. 1992, No. 340, Kenneth Mason Publications, Ltd., England, Disclosed Anonymously, "End-Point Detection Oxide Polishing And Planarization Of Semiconductor Devices".

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