In-situ endpoint control apparatus for semiconductor wafer polis

Abrading – Precision device or process - or with condition responsive... – Computer controlled

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

451 6, 451 7, 451290, 451285, B24B 4900, B24B 5100

Patent

active

058656650

ABSTRACT:
Endpoint determination of a wafer removal process, in-situ, is afforded by the use of a Kalman filter known to be useful in celestial navigation. The use of line variable displacement transducers provides position error correction for the Kalman filter and the Preston equation provides the initial calibration for the endpoint determination. Accuracies of fifty angstrom are achieved.

REFERENCES:
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5196353 (1993-03-01), Sandhu et al.
patent: 5240552 (1993-08-01), Yu et al.
patent: 5413941 (1995-05-01), Koos et al.
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5597442 (1997-01-01), Chen et al.
patent: 5643050 (1997-07-01), Chen
patent: 5655951 (1997-08-01), Meikle et al.
patent: 5658183 (1997-08-01), Sandhu et al.
patent: 5659492 (1997-08-01), Li et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

In-situ endpoint control apparatus for semiconductor wafer polis does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with In-situ endpoint control apparatus for semiconductor wafer polis, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and In-situ endpoint control apparatus for semiconductor wafer polis will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1111688

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.