In-situ doped silicon using tertiary butyl phosphine

Fishing – trapping – and vermin destroying

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148DIG40, 148DIG122, 437959, 437967, 437971, H01L 21469

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active

050968564

ABSTRACT:
The disclosure relates to a method of forming in situ phosphorous doped polysilicon wherein a surface upon which phosphorous doped polysilicon is to be deposited is placed in a vacuum furnace and, after low pressure HCl cleaning of the surface and furnace, a predetermined ratio of silane and a gaseous phosphorous containing compound taken from the class consisting of phosphorous trichloride, tertiary butyl phosphine, isobutyl phosphine, trimethyl phosphate and tetramethyl phosphate are simultaneously passed through the furnace at predetermined pressure and temperature to provide a uniformly phosphorous doped layer of polysilicon on the surface.

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Sze, S. M., VLSI Technology, McGraw-Hill Book Company, Bell Laboratories, Inc. pp. 102-103.

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