In-situ chemical-mechanical planarization pad metrology...

Details In-situ chemical-mechanical planarization pad metrology... In-situ chemical-mechanical planarization pad metrology...

2007-04-10

2007-04-10

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S006000, C451S010000, C451S011000, C451S021000, C451S056000

Reexamination Certificate

active

10970338

ABSTRACT:
Chemical-mechanical planarization (CMP) apparatus and methods for detecting polishing pad properties using ultrasonic imaging is presented. An ultrasonic probe assembly transmits ultrasonic signals onto the surface of a polishing pad during a CMP process. Reflected ultrasonic signals are collected and analyzed to monitor polishing pad properties in real-time. This allows CMP process adjustments to be made during the CMP process.

REFERENCES:
patent: 5399234 (1995-03-01), Yu et al.
patent: 5655951 (1997-08-01), Meikle et al.
patent: 5690540 (1997-11-01), Elliott et al.
patent: 5736427 (1998-04-01), Henderson
patent: 5738567 (1998-04-01), Manzonie et al.
patent: 5829439 (1998-11-01), Yokosawa et al.
patent: 5879226 (1999-03-01), Robinson
patent: 5972792 (1999-10-01), Hudson
patent: 5976000 (1999-11-01), Hudson
patent: 6045434 (2000-04-01), Fisher et al.
patent: 6062958 (2000-05-01), Wright et al.
patent: 6120349 (2000-09-01), Nyui et al.
patent: 6194231 (2001-02-01), Ho-Cheng et al.
patent: 6213845 (2001-04-01), Elledge
patent: 6244944 (2001-06-01), Elledge
patent: 6264532 (2001-07-01), Meloni
patent: 6273800 (2001-08-01), Walker et al.
patent: 6482077 (2002-11-01), Doan et al.
patent: 6684704 (2004-02-01), Obeng
patent: 6798529 (2004-09-01), Saka et al.

Affiliated with

Also associated with

Rating

In-situ chemical-mechanical planarization pad metrology... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with In-situ chemical-mechanical planarization pad metrology..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and In-situ chemical-mechanical planarization pad metrology... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3739865