In-process tape bur monitoring

Details In-process tape bur monitoring In-process tape bur monitoring

2005-01-25

2005-01-25

Ashley, Boyer D. (Department: 3724)

Cutting

Processes

With subsequent handling

C083S061000, C083S073000, C083S075000, C083S076800, C083S367000, C083S371000, C083S922000, C156S064000, C156S267000, C156S353000, C451S006000, C451S041000

Reexamination Certificate

active

06845695

ABSTRACT:
The protective tape applied to the front surface of a semiconductor wafer to protect the wafer during backgrinding must be trimmed so that excess tape, known as tape bur, does not extend beyond the perimeter of the wafer. Tape bur may interfere with backgrinding by causing improper grinding, which may lead to wafer breakage. The tape cutter that trims the protective tape to eliminate tape bur is provided with a sensor which detects whether tape bur has been trimmed from the wafer. If tape bur has not been removed from the wafer, corrective action is taken to prevent the wafer from being backgrinded.

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