In-place bonding of microstructures

Details In-place bonding of microstructures In-place bonding of microstructures

2007-05-21

2008-11-25

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C257SE21088

Reexamination Certificate

active

07456081

ABSTRACT:
A method for bonding microstructures to a semiconductor substrate using attractive forces, such as, hydrophobic, van der Waals, and covalent bonding is provided. The microstructures maintain their absolute position with respect to each other and translate vertically onto a wafer surface during the bonding process. The vertical translation of the micro-slabs is also referred to herein as “in-place bonding”. Semiconductor structures which include the attractively bonded microstructures and substrate are also disclosed.

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