In-place bonding of microstructures

Details In-place bonding of microstructures In-place bonding of microstructures

2007-07-03

2007-07-03

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C257SE21086

Reexamination Certificate

active

10978551

ABSTRACT:
A method for bonding microstructures to a semiconductor substrate using attractive forces, such as, hydrophobic, van der Waals, and covalent bonding is provided. The microstructures maintain their absolute position with respect to each other and translate vertically onto a wafer surface during the bonding process. The vertical translation of the micro-slabs is also referred to herein as “in-place bonding”. Semiconductor structures which include the attractively bonded microstructures and substrate are also disclosed.

REFERENCES:
patent: 4933601 (1990-06-01), Sagawa et al.
patent: 5473192 (1995-12-01), Golubic et al.
patent: 5923091 (1999-07-01), Nagai
patent: 6666979 (2003-12-01), Chinn et al.
patent: 6767802 (2004-07-01), Maa et al.
patent: 6858518 (2005-02-01), Kondo
patent: 7041178 (2006-05-01), Tong et al.
patent: 2002/0182775 (2002-12-01), Belford
patent: 2003/0006416 (2003-01-01), Dudoff et al.
patent: 2003/0013287 (2003-01-01), Lochtefeld et al.
patent: 2003/0186073 (2003-10-01), Fitzgerald
patent: 2004/0029356 (2004-02-01), Timme et al.
patent: 2004/0075141 (2004-04-01), Maeda et al.
patent: 2004/0126958 (2004-07-01), Usuda et al.
patent: 2004/0251464 (2004-12-01), Lee
patent: 2004/0253792 (2004-12-01), Cohen et al.
patent: 2005/0020094 (2005-01-01), Forbes et al.
patent: 2005/0227455 (2005-10-01), Park et al.
patent: 2006/0011982 (2006-01-01), Forbes

Affiliated with

Also associated with

Rating

In-place bonding of microstructures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with In-place bonding of microstructures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and In-place bonding of microstructures will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3813581