In-mold process for fabrication of molded plastic printed circui

Details In-mold process for fabrication of molded plastic printed circui In-mold process for fabrication of molded plastic printed circui

1986-03-21

1987-12-01

Kittle, John E.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 174 685, 29846, 430311, 430325, 1566591, B32B 300, H05K 100, G03C 500, B44C 122

Patent

active

047104198

ABSTRACT:
A molding process and resulting product is disclosed in which a printed circuit pattern carrier is placed in a mold and is molded to an insulation carrier. The insulation carrier is disclosed as a printed circuit board or the interior of the insulation housing for an electrical product. Plural laminations molded atop one another are disclosed. The printed circuit carrier has mold gate openings to enable molding of features which extend above the plane of the conductive layer. A printed circuit pattern is applied before the molding step.

REFERENCES:
patent: 2772501 (1956-12-01), Malcolm
patent: 3161945 (1964-12-01), Anderson et al.
patent: 3889363 (1975-06-01), Davis
patent: 4411982 (1983-10-01), Shibuya et al.
patent: 4584767 (1986-04-01), Gregory

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