In-mold mating of substrate material to vinyl skin covering for

Details In-mold mating of substrate material to vinyl skin covering for In-mold mating of substrate material to vinyl skin covering for

1990-09-26

1992-11-17

Woo, Jay H.

Plastic and nonmetallic article shaping or treating: processes

With severing, removing material from preform mechanically,...

Flash or sprue removal type

264257, 2642711, B29D 900

Patent

active

051641356

ABSTRACT:
A method of molding automotive interior trim parts wherein a block of a predetermined thickness and area of a suitable grade of fiber or other suitable insert material is pressed into a molten vinyl shell during the latter's curing cycle. The fiber block or insert becomes fused to the vinyl shell and may expand to approximately three times its original thickness to serve as the backing and mounting insert for the finished two-component interior trim part.

REFERENCES:
patent: 2797179 (1957-06-01), Reynolds et al.
patent: 4123488 (1978-10-01), Lawson
patent: 4228113 (1980-10-01), Van Gasse
patent: 4315884 (1982-02-01), Van Gasse
patent: 4316869 (1982-02-01), Van Gasse
patent: 4356230 (1982-10-01), Emanuel et al.
patent: 4418031 (1983-11-01), Doerer et al.
patent: 4466848 (1984-08-01), Ogawa
patent: 4478660 (1984-10-01), Landler et al.
patent: 4659412 (1987-04-01), Newman et al.
patent: 4734147 (1988-03-01), Moore
patent: 4749613 (1988-06-01), Yamada et al.
patent: 4775580 (1988-10-01), Dighton
patent: 4784911 (1988-11-01), Gembinski et al.
patent: 5087405 (1992-02-01), Maker

Affiliated with

Also associated with

Rating

In-mold mating of substrate material to vinyl skin covering for does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with In-mold mating of substrate material to vinyl skin covering for , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and In-mold mating of substrate material to vinyl skin covering for will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1169966