In-module current source

Details In-module current source In-module current source

2006-08-01

2006-08-01

Pert, Evan (Department: 2826)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C257S724000, C438S106000

Reexamination Certificate

active

07085143

ABSTRACT:
Disclosed is a method and structure for locally powering a semiconductor chip within a package. The structure and method incorporate a local voltage regulator mounted adjacent a semiconductor chip on a top surface of a carrier. The voltage regulator is electrically connected to a power plane disposed within the carrier. The voltage regulator continuously senses the reflected voltage of the power plane at a regulated output port and actively cancels time domain noise within its operational bandwidth. Mounting the voltage regulator on top of the carrier adjacent to the chip minimizes loop inductance between the regulator and power plane and also minimizes delay caused by impedance of the power plane on the current flowing to the chip.

REFERENCES:
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patent: 6396137 (2002-05-01), Klughart
patent: 6646425 (2003-11-01), Miftakhutdinov
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patent: 6803350 (2004-10-01), Lantuejoul et al.
patent: 2002/0008565 (2002-01-01), Ang et al.
patent: 2003/0181075 (2003-09-01), Hartke et al.
patent: 2004/0222514 (2004-11-01), Crane, Jr. et al.

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