In-line voltage plane tests for multi-chip modules

Details In-line voltage plane tests for multi-chip modules In-line voltage plane tests for multi-chip modules

1997-07-23

1999-12-14

Ballato, Josie

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324537, G01R 3102

Patent

active

060022671

ABSTRACT:
A test pad is formed outside an array of pads included in connection structures such as pin mounting pads to which connection pins may be brazed in, for example, bottom side metallurgy of a multi-layer modular electronic package. In-line voltage plane testing may then be accomplished through temporary connections to the test pads for any desired layer, such as top side metallurgy distribution layers, while protecting the pin-mounting pads from physical and/or chemical damage or contamination during manufacturing processes for addition of layers to the electrical interconnection structure of the multi-layer module.

REFERENCES:
patent: 4288911 (1981-09-01), Ports
patent: 4479088 (1984-10-01), Stopper
patent: 4812742 (1989-03-01), Abel et al.
patent: 5059899 (1991-10-01), Farnsworth et al.
patent: 5097205 (1992-03-01), Toyoda
patent: 5239191 (1993-08-01), Sakumoto et al.
patent: 5252844 (1993-10-01), Takagi
patent: 5876842 (1999-03-01), Duffy et al.
patent: 5880590 (1999-03-01), Desai et al.

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