Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2008-04-08
2008-04-08
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
Reexamination Certificate
active
10923792
ABSTRACT:
An embodiment of the present invention relates to an in-line process for making a thin film electronic device on a substrate. The process includes depositing a structurable layer onto a substrate and depositing photoresist material onto the structurable layer in a first pattern. The process also includes developing the photoresist material, etching the structurable layer in areas uncovered by the photoresist material and removing the remaining photoresist material. The process may be performed without intermediate exposure of the substrate to ambient air.
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Dings Franciscus Cornelius
Evers Marinus Franciscus Johannes
Kok Ronaldus Joannes Cornelis Maria
Lebentritt Michael
OTB Group B.V.
Stevenson Andre′
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