In-line method of monitoring die attach material adhesive weight

Details In-line method of monitoring die attach material adhesive weight In-line method of monitoring die attach material adhesive weight

1998-07-20

2000-02-08

Hoff, Marc S.

Data processing: measuring, calibrating, or testing

Measurement system

Weight

702101, 702174, 702175, B23K 3112

Patent

active

060236663

ABSTRACT:
A method and apparatus for monitoring the die attach material adhesive weight in an in-line manner is disclosed. The method and apparatus utilize two weight platforms at pre-dispense and post-dispense positions of an assembly line carrying lead frames. The two platforms weigh the lead frames to obtain pre-dispense and post-dispense weight measurements. These measurements are used by a logic circuit to calculate the weight of the adhesive. The logic circuit upon detection of an inappropriate adhesive weight can sound an alarm, stop the assembly line or automatically adjust a dispenser to administer the appropriate amount of adhesive.

REFERENCES:
patent: 4550793 (1985-11-01), Giles
patent: 5197650 (1993-03-01), Monzen et al.
patent: 5321634 (1994-06-01), Obata et al.
patent: 5662763 (1997-09-01), Yamanaka
patent: 5832600 (1998-11-01), Hashimoto
patent: 5857589 (1999-01-01), Cline et al.

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