In-line automated perforation method using selective...

Details In-line automated perforation method using selective... In-line automated perforation method using selective...

2005-12-27

2005-12-27

Ashley, Boyer D. (Department: 3724)

Selective cutting (e.g., punching)

Methods

C234S050000, C083S076800, C083S076900, C083S345000, C083S670000, C083S370000, C083S368000, C083S694000, C083S691000, C083S938000, C270S058070, C399S407000

Reexamination Certificate

active

06978925

ABSTRACT:
A method for creating multiple punch holes during a finishing process of paper sheets and other sheet materials. A highlight of the present invention is the ability to select between at least two configurations of punch holes automatically, without manual adjustment, and “on-the-fly” without interruption of the sheet or paper flow. The perforation method utilizes two rotatable punches set at different angles such that when one intersects the sheet path, the other clears the sheet path. The speed of rotation is controlled such that the non-selected punch intersects the sheet path in a space between pitches.

REFERENCES:
patent: 2327646 (1943-08-01), Hutchinson
patent: 3705683 (1972-12-01), Tsukihashi
patent: 5253030 (1993-10-01), Shigemura et al.
patent: 5685532 (1997-11-01), Amarakoon
patent: 5887502 (1999-03-01), Yamaguchi et al.
patent: 6065383 (2000-05-01), Takaishi et al.
patent: 6295908 (2001-10-01), Holzhauser et al.
patent: 6305262 (2001-10-01), Watanabe
patent: 6374715 (2002-04-01), Takatsuka
patent: 6381443 (2002-04-01), Kawata et al.
patent: 6549734 (2003-04-01), Yamada et al.
patent: 6672504 (2004-01-01), Ueda et al.
patent: 6869010 (2005-03-01), Morson
patent: 2002/0000149 (2002-01-01), Miura et al.
patent: 2003/0116004 (2003-06-01), Tanaka et al.
patent: 2004/0045421 (2004-03-01), Ueda et al.
patent: 11-44543 (2000-09-01), None
patent: 11-205677 (2001-02-01), None
patent: 2000-169890 (2001-12-01), None

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