In-grid decoupling for ball grid array (BGA) devices

Details In-grid decoupling for ball grid array (BGA) devices In-grid decoupling for ball grid array (BGA) devices

2007-02-23

2009-10-13

Reichard, Dean A. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S261000

Reexamination Certificate

active

07602615

ABSTRACT:
A ball grid array (BGA) having an array of BGA pads on one side and at least a pair of contiguous through board vias, at least a pair of conductive pads surrounding the through hole vias, wherein the conductive pads have octagonal shapes and four sides of each octagonal pad are mutually parallel.

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Ramkumar et al. “Lead-free 0201 manufacturing, assembly and reliability test results”, Microelectronics and Reliability, Elsevier Science Ltd., vol. 46, No. 2-4, Feb. 1, 2007.

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