In circuit modification device for dual in line packaged compone

Details In circuit modification device for dual in line packaged compone In circuit modification device for dual in line packaged compone

1983-01-05

1985-05-14

Weidenfeld, Gil

Geometrical instruments

339 17C, 339 17M, 339176MP, H05K 100

Patent

active

045168164

ABSTRACT:
In circuit modifications of dual in line packaged (DIP) devices are realized by a circuit modification device that interfaces the DIP and its companion device. A first pair of single in line packaged (DIP) header pins are mounted on a printed circuit (PC) board such that they form a socket for the DIP device. A second pair of SIP header pins are mounted adjacent to the first pair and extend through the PC board to form a plug for the companion device. Header pins are interconnected by the printed circuit to effect the desired DIP device circuit reconfiguration. Packaging is accomplished with commercially available components and does not impact system size, weight or power constraints.

REFERENCES:
patent: 3409862 (1968-11-01), Lynch et al.
patent: 3486160 (1969-12-01), Wallace
patent: 3644792 (1972-02-01), Fields
patent: 3670207 (1972-06-01), Seabury
patent: 3876274 (1975-04-01), Reuhlemann et al.
patent: 4025147 (1977-05-01), Van Arsdale et al.
patent: 4157207 (1979-06-01), Robinson

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