In-chip structures and methods for removing heat from...

Details In-chip structures and methods for removing heat from... In-chip structures and methods for removing heat from...

2006-05-30

2010-02-02

Fahmy, Wael (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S276000, C257SE21407, C174S250000, C361S780000, C438S122000

Reexamination Certificate

active

07656027

ABSTRACT:
An in-chip system and method for removing heat from integrated circuits is disclosed. One embodiment is a substrate with a front side and a back side. The front side of the substrate is capable of having formed thereon a plurality of transistors. A plurality of structures within the substrate contain a solid heat conductive media comprising carbon nanotubes and/or a metal, such as copper. At least some of the plurality of structures extend from the back side of the substrate into the substrate. In some embodiments, the carbon nanotubes are formed within the substrate using a catalyst.

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