Impurity doping apparatus

Coating apparatus – Gas or vapor deposition – With treating means

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156345, 118719, 118715, H01L 2100

Patent

active

051999943

ABSTRACT:
Impurity doping apparatus composed of a vacuum chamber, a heater for heating a silicon substrate in the chamber, and a gas supply source for supplying a diborane gas containing an impurity component of boron to the chamber. A regulating valve is disposed between the chamber and the gas supply source to regulate gas flow rate. A CPU is provided to control the heater and the regulating valve according to a given sequence of first, second and third procedures so as to dope the boron into the silicon substrate. The CPU operates according to the first procedure to effect heating of the silicon substrate in the vacuum chamber to activate a surface of the silicon substrate. The CPU operates according to the second procedure to effect charging of the diborane gas into the vacuum chamber while heating the silicon substrate to deposit a boron adsorption film on the activated surface. The CPU operates according to the third procedure to effect annealing of the substrate to diffuse the boron from the adsorption film into the bulk of the silicon substrate.

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patent: 4940505 (1990-07-01), Schachameyer et al.
patent: 4962726 (1990-10-01), Matsushita et al.
"VLSI Fabrication Principles; Silicon and Gallium Arsenide"; by Sorab Ghandhi; .COPYRGT.1982; John Wiley & Sons; New York, N.Y., pp. 141-176.

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