Impurity concentration distribution predicting method and...

Computer-aided design and analysis of circuits and semiconductor – Design of semiconductor mask or reticle – Analysis and verification

Reexamination Certificate

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C716S050000, C716S054000, C716S055000, C716S056000, C257S101000, C257S219000, C257S335000, C257S655000, C438S302000

Reexamination Certificate

active

07992108

ABSTRACT:
First and second evaluation substrates are prepared, a direction perpendicular to a surface of the first evaluation substrate being defined by first indices, and the direction defined by the first indices being inclined from a normal direction of a surface of the second evaluation substrate. Ion implantation is performed for the first evaluation substrate in a vertical direction. Ion implantation is performed for the second evaluation substrate by using an ion beam parallel to the direction defined by the first indices. Impurity concentration distributions in a depth direction of the first and second evaluation substrates are measured. A first impurity concentration distribution on an extension line of an ion beam and a second impurity concentration distribution in a direction perpendicular to the extension line are predicted from the measured impurity concentration distributions of the first and second evaluation substrates.

REFERENCES:
patent: 6905893 (2005-06-01), Narayanan et al.
patent: 2004/0238883 (2004-12-01), Nishinohara et al.
patent: 2000-138178 (2000-05-01), None
patent: 2003-163173 (2003-06-01), None
K. Suzuki et al.; “Estimating Lateral Straggling of Impurity Profiles of Ions Implanted Into Crystalline Silicon”; IEEE Transcation on electron Devices, vol. 48, No. 12, pp. 2803-2807, Dec. 2001, cited in the ISR.
K. Suzuki et al.; “Analytical expression for ion-implanted impurity concentration profiles”; Solid-State Electronic, vol. 44, pagtes 22-53-2257. 2000.
International Search Report of PCT/JP2005/012138, date of mailing Oct. 18, 2005.
Notification of Transmittal of Translation of the International Preliminary Report on Patentability of International Application No. PCT/JP 2005/012138, with Form PCT/IB/373 and Form PCT/ISA/237, Mail Jan. 9, 2008.

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